[Manufacturing]

PCB
  PCB Product
  Normal
  Flexible
  Special
  PCB Capability
  Quality
  Quality Policy
  Quality Activities

 

Quality Inspection
LCD
PSU

[OEM]

Contract Manufacturing
  RCU
  Telephone

[Retail]

Cable Assembly
  Normal
  Special Cable
Electrical parts
  LED
  Resistor
  Capacitor
  MLCC

 

Connector

 

RCA PinJack

 

Rubber KeyPad

 

F-Connectors


 
PCB Manufacturing Process    PCB Product[Nomal l Fiexble l Special]     PCB Capability
Quality[Quality Policy l Quality Activities l Quality Inspection]

  PCB Manufacturing Process  
 
CAD/CAM
After designing pattern of inner/outer layer
processing DATA with considering working conditions.



 
SHEARING
It is a shearing process to cut the raw copper plates in a desired panel size.
in this process step,We carefully control the raw copper plate
in order to remove the defect sources due to scratch,pressing,
and spearing that may result in a substantial defects in back-end processes



 
IMAGING(inner layer)
Improving adhesive of LPR due to
Forming roughness.



 
ETCHING(inner layer)
Development : dissolving except hardened parts
by exposing to UV.
Corrosion : Removing disclosed copper foil
that isn¡¯t forming pattern.
Peeling : Peeling off D/F resist that complete
its part as anti-corrosion foil.



 
INSPECTION(inner layer)
Inspection image conditiom of
inner layer with optical method and
facilitios.



 
OXIDE
Process of surface to improve
adhesiveness between each layer
during pressing.



 
LAY UP/LAMINATION
To produce MLB, heating and putting pressure
on previously stacked product to form inner/outter layer
and MASS-LAM which is stable hardened state.



 
DRILL
As being equiooed automatic input loader,
it does not necessary to have a period for
changing process.



 
PLATING
A process making connections between conductor layers
forming solderbility inside hole by plaing copper
after drilling porcess.



 
IMAGING(out layer)
Expose resist that is sprayed on or stuck to the surface
of a copper foil to UV to polynerize and
to form patterns that are wanted.



 
ETCHING(out layer)
Development : dissolving except hardened parts by exposing to UV.
Corrosion : Removing disclosed copper foil
that isn¡¯t forming pattern.
Peeling : Peeling off D/F resist that complete
its part as anti-corrosion foil.



 
INSPECTION(out layer)
Irradiating a pay to board to compare data given
for working with data got from irradiation
and to check problems.



 
SOLDER MASK
Before PSR printing forming special tone on board to
Increase adhesiveness with PSR.



 
LEGEND
Print Symbol and lettering with invariable ink on board.



 
FINLA FINISH
Immersion nikel & gold plating on the surface of copper as a kind of
surface treatment.



 
ROUT
Processing produces according to shipping standard or kit,
which is first throwed in as a unit of PNL.



 
ELECTRONICAL TESTING
Electrical connection test for a large quantity of products by JIG.



 
FINAL VISUAL INSPECTION
Checking whether a finished product meets standard requirements. (Surface)



 
OUT GOING INSPECTION
Inspecting finaly inspected products not to ship in congruent
products to customers.



 
PACKING
Packing products with care not to be damaged for shipping.